were received in a shipment, for the following identi-
(2) Inspect all controls and switches for proper
operation and loose or missing hardware.
1 Purchase order number.
(3) Inspect all connectors, plugs, and cord recep-
2 Date packaged or packed.
tacles for condition and damage.
(4) Inspect cabling and wiring for potential short
3 Depot certification stamp and date.
(b) A group of like items repaired or rebuilt
by the Maintenance Division in one production run.
(2) Lot formarion. The items shall be assembled
(5) Inspect solder connections for missing solder,
into identifiable lots. Each lot shall, as far as practi-
cold solder, insufficient solder, excessive solder, and
cable, consist of units of product of a single type.
(6) Inspect for illegible, incorrect, or missing
repaired, or rebuilt at the same time and stored
under the same conditions. It is recommended that
(7) Inspect for corrosion, dirt, moisture, and
equipments from different limited production buys
be placed in different lots and that the equipment
(8) Inspect all parts and hardware for damage
serial numbers, by limited production buy, be used
as a lot formation criteria.
d. Test Requirements. Perform those tests that are
specified for each Radar Set AN/PPS-5 and AN/PPS-
Limired Production Buy
5A listed in appendix B.
e. Defect Classification.
(a) Critical. Refer to the definition of a critical
(3) Lot size. The lot size is the total number of
1 Damage due to handling or storage
individual like items in the lot that is to be inspected.
(crushed, deformed, or broken).
b. Sampling Procedure.
(1) Sample selection. Select samples of materiel
in a way which will assure that each unit in the lot
3 Solderiess connectors: defects
has an equal chance of being selected. Biased
methods, such as selecting items from the same posi-
4 Cabling and wiring: defects as listed in
tion in a container, pallets, or stacks: taking items
all from one location; or selecting items that appear
5 Hardware: defects as listed in MIL-STD-
defective, will not be used.
(2) Sample size. Use table I of MIL-STD-105D.
6 Foreign objects: defects as listed in MIL-
General Inspection Level II, to obtain the sample
size code letter, and table IIA of MIL-STD-105D, to
7 Potential short circuits: defects as listed in
obtain the sample size using the storage quality
levels shown in (3) below.
(3) Storage quality levels (SQL).
8 Finish: defects as listed in MIL-STD-252A.
9 Marking: defects as listed in MIL-STD-
(a) Mechanical-visual inspection: Critical
SQL 1.0 percent: major SQL 2.5 percent: minor SQL
10 Parts: defects as listed in MIL-STD-252A.
(b) Electrical: Critical SQL 1.0 percent: major
11 Contacts: defects as listed in MIL-STD-
SQL 2.5 percent.
(c) Preservation, packaging, packing, and
12 Plating, painting, or MFP missing.
13 Dimensional: a dimensional defect which
marking: major SQL 4.0 percent: minor SQL 10 per-
directly affects interchangeability, assembly, or
(d) The acceptance or reject number for the
above SQLs shall be the same as those shown for com-
parable acceptance quality levels (AQLs) in table
IIA of MIL-STD-105D.
2 Solderless connectors: defects as listed in
c. Inspection Requiements. The following mechan -
ical-visual inspections shall be performed:
(1) Inspect case for physical damage, condition,
3 Cabling and wiring: defects as listed in